Best selling thermal conductive phase changing interface materials TIC805k for LED lighting

The TIC805K Series products is a high thermal conduction and dielectric performance insulator pad

consisting of a ceramic filled low melting point compound coated on MT Kapton film.At 50℃,TIC805K Series surface begins to soften and flow, filling the microscopic irregularities of both thethermal solution and the integrated circuit package surface, thereby reducing thermal resistance

Features

Naturally tacky at room temperature, no adhesive required

No heat sink preheating required

Low thermal resistance

Ease of use for high volume manufacturing

High thixotropic index

Dry to the touch for pre-apply applications

High thermal reliability, minimal pump out

Re-flow compatible

Cost Effective

Used where electrical isolation is not required

Low volatility – less than 1%

Easy to handle in the manufacturing environment

Flows but doesn’t run like grease

Available in custom die-cut shapes, kiss-cut on rolls

RoHS Compliant

Applications

High Frequency Microprocessors

Notebook

Computer Serves

Memory Modules

Cache Chips

IGBTs

COB Led

Desktop PCs

CPU

Microprocessors

Chipsets

Graphic Processing Chips

Custom ASICs

Servers

Memory Modules

Power semiconductors

Power conversion modules

LED Power Supply

LED Controller

LED Lights

LED Ceilinglamp

Standard Thicknesses:

0.003"(0.076mm)          0.005"(0.127mm)          0.008"(0.203mm)          0.010"(0.254mm)                  
Consult the factory alternate thickness.

Standard Sizes:

9" x 18"(228mm x 457mm)      9" x 400'(228mm x 121M)            
TIC?800 series are supplied with a white release paper and a bottom liner. TIC?800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive: 

Peressure Sensitive Adhesive is not applicable for TIC?800 series products.

Reinforcement: 

No reinforcement is necessary.